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ZHENGZHOU JINCHUAN ABRASIVES CO., LTD. 86-371-86588970 Jack@jcabrasives.com
Diameter 175 mm 4V2 Resin Dish-shaped Grinding Wheel For Carbide Saws Grinding

Diameter 175 mm 4V2 Resin Dish-shaped Grinding Wheel For Carbide Saws Grinding

  • Highlight

    Carbide Saws Grinding Wheel

  • Specification
    175*12*50.8*4*2 Mm
  • Application
    Carbide Saws Grinding
  • Package
    Carton Box
  • Grit Size
    D76
  • Center Material
    Steel
  • Max Rpm
    13,000
  • Concentration
    125%
  • Delivery
    By Express
  • Colour
    Silver,Brown
  • Thinckness
    12mm
  • Shape
    Dish
  • HS Code
    6804211000
  • Bond Material
    Resin
  • Wheel Hardness
    Hard
  • Diamond Class
    First Class
  • Place of Origin
    China
  • Brand Name
    JC
  • Certification
    ISO
  • Model Number
    4V2
  • Minimum Order Quantity
    5pieces
  • Price
    Exw
  • Packaging Details
    Cardboard Box
  • Delivery Time
    5-10 work days
  • Payment Terms
    T/T, L/C, Western Union,Paypal
  • Supply Ability
    10,000 pcs/month

Diameter 175 mm 4V2 Resin Dish-shaped Grinding Wheel For Carbide Saws Grinding

4V2 175mm Resin Bond Diamond Grinding Wheel Product Description


Product Name: Resin Bond Diamond Grinding Wheel
Product Overview:
Resin bond diamond grinding wheels are super-hard abrasive tools made by hot pressing diamond as the abrasive and resin as the binder. They are characterized by high grinding efficiency, high machining accuracy, and long service life. These wheels are widely used for grinding hard and brittle materials such as cemented carbide, ceramics, glass, and semiconductors.Diamond particles provide super strong cutting force, specializing in hard and brittle materials such as ceramics, glass, carbide, stone, etc.The resin bond gives the grinding wheel excellent elasticity and self-sharpening properties, ensuring that it remains sharp and has a high surface finish after long-term operation.

 

Applications:

 

Grinding of cemented carbide tools and molds

Precision grinding of ceramic materials

Lapping and polishing of optical glass

Cutting and grinding of semiconductor materials

 

Specifications:

Diameter Thickness: Inner Hole: Width of abrasive: Depth of abrasive: Grit: Concentration:
125mm 9.6mm
 
32mm
 
4mm 2mm D76 C125
160mm
175mm 12mm 50.8mm

Diameter 175 mm 4V2 Resin Dish-shaped Grinding Wheel For Carbide Saws Grinding 0

Of course, if you need other sizes, we can also customize them for you.

 

Why choose us?
ISO 9001 certification, quality assurance;
Support customized services, flexible adaptation of specifications, particle size, and hardness;
Professional technical team provides selection and after-sales support.