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11A2 Resin Diamond Grinding Wheel 100mm Resinoid Grinding Disc

11A2 Resin Diamond Grinding Wheel 100mm Resinoid Grinding Disc

  • Package
    Carton Box
  • Wheel Size
    100*30*31.75*12*6mm
  • Concentration
    C100
  • Colour
    Gray
  • Abrasives
    Diamond
  • Delivery
    By Express
  • Grains
    D64
  • Place of Origin
    China
  • Brand Name
    JC
  • Certification
    ISO
  • Model Number
    6A2
  • Minimum Order Quantity
    5
  • Price
    Negotiable
  • Packaging Details
    Wooden box
  • Delivery Time
    5-8 work days
  • Payment Terms
    T/T
  • Supply Ability
    1000/month

11A2 Resin Diamond Grinding Wheel 100mm Resinoid Grinding Disc

11A2 Resin Diamond Grinding Wheel 100mm Resinoid Grinding Disc

 

 

11A2 resin bond diamond grinding wheel** is a specialized abrasive tool designed for precision grinding of hard, non-ferrous materials, ceramics, and composites.

 

Grit size incl. Mesh 80/100#(D181), 100/120#(D151), 120/140#(D126), 140/170#(D107), 170/200#(D91), 200/230#(D76), 230/270#(D64), 270/325#(D54), 325/400#(D46)

 

Diamond** is the hardest known abrasive, ideal for grinding:
- **Carbide tools** (tungsten carbide, PCD, PCBN inserts).
- **Ceramics** (alumina, zirconia, silicon carbide).
- **Glass, sapphire, and brittle composites**.
- *Not suitable for ferrous metals* (carbon reacts with diamond, causing excessive wear).

 

Resin bond (Bakelite/phenolic)** offers:
- **Smooth cutting action** with fine surface finishes.
- **Good shock absorption**, reducing chipping in brittle materials.
- **Lower heat generation** vs. metal/vitrified bonds.
- Typically used for **fine grits (100–2000#)** and precision grinding.

 

Size Diameter Thickness Inner hole Grit Size
  100mm 30mm 31.75mm

D64

 

 

 


Advantages Over Conventional Wheels
- Longer lifespan than aluminum oxide wheels.
- Better heat dissipation.
- Maintains profile accuracy for precision grinding.

ApplicationsCarbide tool grinding** (end mills, drills, inserts).
- **Optical lens/polishing work**.
- **Ceramic component machining**.
- **Electronics industry** (grinding semiconductor materials).

 

 

11A2 Resin Diamond Grinding Wheel 100mm Resinoid Grinding Disc 0

 

If you need to customize, please provide the following information:

1. Dimensions, including outer diameter, aperture, thickness, width and thickness of abrasive layer;

2. Abrasive, abrasive sand particle and concentration;

3. Adhesive;

4. Wheel application;

5. Pictures and drawings of wheels;

We can then design and quote for you